POLYMODAL FILLER DISTRIBUTION AND THERMAL CONDUCTIVITY IN COMPOSITES
DOI:
https://doi.org/10.30888/2709-2267.2026-35-00-013Ключові слова:
thermal conductivity, polymer composites, interfacial thermal resistance, hybrid fillers, filler morphology, interconnected conductive pathwaysАнотація
Thermally conductive polymer composites represent a vital area of research within material science and industrial engineering due to their manufacturing simplicity, sustainability, and low production costs. Nevertheless, the development of high efficiency
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Опубліковано
2025-09-30
Як цитувати
Писаренко, О. (2025). POLYMODAL FILLER DISTRIBUTION AND THERMAL CONDUCTIVITY IN COMPOSITES. Sworld-Us Conference Proceedings, 1(usc35-00), 49–53. https://doi.org/10.30888/2709-2267.2026-35-00-013
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Авторське право (c) 2026 Автори
Ця робота ліцензується відповідно до Creative Commons Attribution 4.0 International License.
